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www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz02201-0rar1g200630-1-2 tsz22111 ? 14 ? 001 1/17 20.feb.2013 rev.001 operational amplifier series automotive low noise operational amplifiers ba4558yxxx-m general description ba4558yxxx-m integrates two independent op-amps on a single chip. this op-amp has some features of low noise and low distortion characteristics and can operate from 4.0v to 15v(split supply). ba4558yxxx-m is manufactured for automotive requirements of car navigation system, car audio, etc. features ? aec-q100 qualified ? high voltage gain ? low noise ? low distortion ? wide operating supply voltage ? internal esd protection circuit ? wide operating temperature range key specifications ? wide operating supply voltage (split supply): 4.0v to 15v ? wide temperature range: -40c to +105c ? high slew rate: 1v/s(typ.) ? total harmonic distortion : 0.005%(typ.) ? input referred noise voltage : 12 hz nv/ (typ.) packages w(typ.) x d(typ.) x (max.) sop8 5.00mm x 6.20mm x 1.71mm ssop-b8 3.00mm x 6.40mm x 1.35mm msop8 2.90mm x 4.00mm x 0.90mm application ? car navigation system ? car audio simplified schematic product structure silicon monolithic integrated circuit this product is not designed protection against radioactive rays. figure 1. simplified schematic (one channel only) in in vou t vcc vee out downloaded from: http:///
datasheet www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz02201-0rar1g200630-1-2 tsz22111 ? 15 ? 001 2/17 20.feb.2013 rev.001 ba4558yxxx-m c - + c + - - + ee - + cc pin configuration BA4558YF-M : sop8 ba4558yfv-m : ssop-b8 ba4558yfvm-m : msop8 pin no. symbol 1 out1 2 -in1 3 +in1 4 vee 5 +in2 6 -in2 7 out2 8 vcc package sop8 ssop-b8 msop8 BA4558YF-M ba4558yfv-m ba4558yfvm-m ordering information b a 4 5 5 8 y x x x - m x x parts number. ba4558yxxx package f : sop8 fv : ssop-b8 fvm : msop8 packaging and forming specification m : automotive car navigation system, car audio, etc. e2: embossed tape and reel (sop8/ssop-b8) tr: embossed tape and reel (msop8) line-up topr supply voltage number of channels package orderable parts number -40c to +105c 4.0v to 15v dual sop8 reel of 2500 BA4558YF-Me2 ssop-b8 reel of 2500 ba4558yfv-me2 msop8 reel of 3000 ba4558yfvm-mtr downloaded from: http:///
datasheet www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz02201-0rar1g200630-1-2 tsz22111 ? 15 ? 001 3/17 20.feb.2013 rev.001 ba4558yxxx-m absolute maximum ratings (ta=25 ) parameter symbol ratings unit supply voltage vcc-vee +36 v power dissipation pd sop8 775 *1*4 mw ssop-b8 625 *2*4 msop8 600 *3*4 differential input voltage *5 vid +36 v input common-mode voltage range vicm (vee-0.3) to (vee+36) v operating supply voltage vopr +8.0 to +30 (4.0 to 15) v operating temperature ra nge topr -40 to +105 storage temperature range tstg -55 to +150 maximum junction temperature tjmax +150 note: absolute maximum rating item indicates the condition which must not be exceeded. application if voltage in excess of absolute maximum ra ting or use out of absolute maximum rated temperature environment may cause deterior ation of characteristics. *1 to use at temperature above ta 25 reduce 6.2mw/ . *2 to use at temperature above ta 25 reduce 5.0mw/ . *3 to use at temperature above ta 25 reduce 4.8mw/ . *4 mounted on a fr4 glas s epoxy pcb(70mm70mm1.6mm). *5 the voltage difference between inverting input and non-in verting input is the differential input voltage. then input terminal voltage is set to more than vee. downloaded from: http:///
datasheet www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz02201-0rar1g200630-1-2 tsz22111 ? 15 ? 001 4/17 20.feb.2013 rev.001 ba4558yxxx-m electrical characteristics ba4558yxxx-m (unless otherwise specified vcc=+15v, vee=-15v, full range -40 to +105 ) parameter symbol temperature range limits unit condition min. typ. max. input offset voltage *6 vio 25 - 0.5 6 mv out=0v full range - - 7 input offset current *6 iio 25 - 5 200 na out=0v full range - - 200 input bias current *7 ib 25 - 60 500 na out=0v full range - - 800 supply current icc 25 - 3 6 ma rl= , all op-amps vin+=0v full range - - 6.5 maximum output voltage vom 25 10 13 - v rl 2k ? full range 10 - - 25 12 14 - rl 10k ? large signal voltage gain av 25 86 100 - db rl 2k ? , out=10v vicm=0v full range 83 - - input common-mode voltage range vicm 25 12 14 - v - full range 12 - - common-mode rejection ratio cmrr 25 70 90 - db ri 10k ? power supply rejection ratio psrr 25 76.5 90 - db ri 10k ? slew rate sr 25 - 1 - v/ s av=0db, rl=2k ? cl=100pf unity gain frequency f t 25 - 2 - mhz rl=2k ? total harmonic distortion +noise thd+n 25 - 0.005 - % av=20db, rl=10k ? vin=0.05vrms, f=1khz input referred noise voltage vn 25 - 12 - hz nv/ rs=100 ? , vi=0v, f=1khz - 1.8 - vrms rs=100 ? vi=0v, din-audio channel separation cs 25 - 105 - db r1=100 ? , f=1khz *6 absolute value *7 current direction: since first input stage is composed with pnp transistor, input bias current flows out of ic. downloaded from: http:///
datasheet www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz02201-0rar1g200630-1-2 tsz22111 ? 15 ? 001 5/17 20.feb.2013 rev.001 ba4558yxxx-m description of electri cal characteristics described here are the terms of electric characteristics used in this datasheet. items and symbols used are also shown. note that item name and symbol and their meaning may differ fr om those on another manufactures document or general document. 1. absolute maximum ratings absolute maximum rating item indicates the condition which mu st not be exceeded. application of voltage in excess of absolute maximum rating or use out of absolute maximum ra ted temperature environment may cause deterioration of characteristics. 1.1 power supply voltage (vcc-vee) indicates the maximum voltage that can be applied between the positive power supply terminal and negative power supply terminal without deterioration or destruct ion of characteristics of internal circuit. 1.2 differential input voltage (vid) indicates the maximum voltage that can be applied between non-inverting terminal and inverting terminal without deterioration and destruction of characteristics of ic. 1.3 input common-mode voltage range (vicm) indicates the maximum voltage that can be applied to non-inverting terminal and inverting terminal without deterioration or destruction of characte ristics. input common-mode voltage rang e of the maximum ratings not assure normal operation of ic. when normal operation of ic is desired, the input common-mode voltage of characteristics item must be followed. 1.4 power dissipation (pd) indicates the power that can be consumed by specified mounted board at t he ambient temperature 25 (normal temperature). as for package product, pd is determined by the temper ature that can be permitted by ic chip in the package (maximum junction temperature)and thermal resistance of the package. 2. electrical characteristics item 2.1 input offset voltage (vio) indicates the voltage difference between non-inverting terminal and inverting terminal. it can be translated into the input voltage difference required for setting the output voltage at 0v. 2.2 input offset current (iio) indicates the difference of input bias current bet ween non-inverting terminal and inverting terminal. 2.3 input bias current (ib) indicates the current that flows into or out of the input terminal. it is defined by the average of input bias current at non-inverting terminal and input bias current at inverting terminal. 2.4 circuit current (icc) indicates the ic current that flows under specified conditions and no-load steady status. 2.5 output saturation voltage (vom) signifies the voltage range that can be out put under specific output conditions. 2.6 large signal voltage gain (av) indicates the amplifying rate (gain) of output voltage against the voltage difference between non-inverting terminal and inverting terminal. it is normally the amplifying rate (gain) with reference to dc voltage. av = (output voltage) / (differential input voltage) 2.7 input common-mode voltage range (vicm) indicates the input voltage range where ic operates normally. 2.8 common-mode rejection ratio (cmrr) indicates the ratio of fluctuation of input offset voltage when in-phase input voltage is changed. it is normally the fluctuation of dc. cmrr = (change of input common-mode voltage)/(input offset fluctuation) 2.9 power supply rejection ratio (psrr) indicates the ratio of fluctuation of in put offset voltage when supply voltage is changed. it is normally the fluctuation of dc. psrr = (change of power supply volta ge) / (input offset fluctuation) 2.10 slew rate (sr) sr is a parameter that shows movement speed of operational amplifier. it indicates rate of variable output voltage as unit time. 2.11 unity gain frequency (f t ) indicates a frequency where the voltage gain of operational amplifier is 1. 2.12 total harmonic distortion + noise (thd+n) indicates the fluctuation of input offset voltage or that of output vo ltage with reference to the change of output voltage of driven channel. 2.13 input referred noise voltage (vn) indicates a noise voltage generated inside the operational amplifier equivalent by ideal voltage source connected in series with input terminal. 2.14 channel separation (cs) indicates the fluctuation of input offset voltage or that of output vo ltage with reference to the change of output voltage of driven channel. downloaded from: http:///
datasheet www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz02201-0rar1g200630-1-2 tsz22111 ? 15 ? 001 6/17 20.feb.2013 rev.001 ba4558yxxx-m typical performance curves ba4558yxxx-m (*) the above data is measurement value of typical sample, it is not guaranteed. 0 200 400 600 800 10 00 02 55 07 51 0 01 2 5 ambie nt te mp erture [ ] . power dissipation [mw] . figure 5. maximum output voltage swing - load resistance (vcc/vee=+15v/-15v, ta=25 ) 0 5 10 15 20 25 30 0.1 1 10 load resistance [k ] maximum output voltage swing [v p- p ] figure 3. supply current - supply voltage 0.0 1.0 2.0 3.0 4.0 5.0 0 5 10 15 20 25 30 35 supply voltage [v] supply current [ma] . 25 105 -40 figure 2. derating curve 105 BA4558YF-M ba4558yfvm-m ba4558yfv-m figure 4. supply current - ambient temperature 0.0 1.0 2.0 3.0 4.0 5.0 -50 -25 0 25 50 75 100 125 ambient temperature [ ] supply current [ma] 4 v 15v 7.5 v downloaded from: http:///
datasheet www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz02201-0rar1g200630-1-2 tsz22111 ? 15 ? 001 7/17 20.feb.2013 rev.001 ba4558yxxx-m ba4558yxxx-m (*) the above data is measurement value of typical sample, it is not guaranteed. figure 6. maximum output voltage - load resistance (vcc/vee=+15v/-15v, ta=25 ) -20 -15 -10 -5 0 5 10 15 20 0.1 1 10 load resistance [k ] output voltage [v] voh vol figure 7. maximum output voltage - supply voltage (rl=2k ? , ta=25 ) -20 -15 -10 -5 0 5 10 15 20 4 6 8 10 12 14 16 supply voltage [v] output voltage [v] voh vol figure 9. maximum output voltage - output current (vcc/vee=+15v/-15v, ta=25 ) -20 -15 -10 -5 0 5 10 15 20 0 5 10 15 20 25 output current [ma] output voltage [v] vol voh figure 8. maximum output voltage - ambient temperature (vcc/vee=+15v/-15v, rl=2k ? ) -20 -15 -10 -5 0 5 10 15 20 -50 -25 0 25 50 75 100 125 ambient temperature [ ] output voltage [v] voh vol downloaded from: http:///
datasheet www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz02201-0rar1g200630-1-2 tsz22111 ? 15 ? 001 8/17 20.feb.2013 rev.001 ba4558yxxx-m ba4558yxxx-m (*) the above data is measurement value of typical sample, it is not guaranteed. figure 10. input offset voltage - supply voltage (vicm=0v, out=0v) -6 -4 -2 0 2 4 6 2 4 6 8 10 12 14 16 supply voltage [v] input offset voltage [mv] -40 105 25 figure 11. input offset voltage - ambient temperature (vicm=0v, out=0v) -6 -4 -2 0 2 4 6 -50 -25 0 25 50 75 100 125 ambient temperature [ ] input offset voltage [mv] 4v 7.5v 15v figure 13. input bias current - ambient temperature (vicm=0v, out=0v) 0 10 20 30 40 50 -50 -25 0 25 50 75 100 125 ambient temperature [ ] input bias current [na] 15v 7.5v 4v figure 12. input bias current - supply voltage (vicm=0v, out=0v) 0 10 20 30 40 50 2 4 6 8 1 0 12 1 4 1 6 s uppl y v olta ge [v] input bias current [na] . -40 25 105 downloaded from: http:///
datasheet www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz02201-0rar1g200630-1-2 tsz22111 ? 15 ? 001 9/17 20.feb.2013 rev.001 ba4558yxxx-m ba4558yxxx-m (*) the above data is measurement value of typical sample, it is not guaranteed. figure 16. input offset voltage - common mode input voltage ( vcc=4v , vee=-4v , out=0v ) figure 15. input offset current - ambient temperature (vicm=0v, out=0v) -60 -40 -20 0 20 40 60 - 50 - 25 0 25 50 75 100 125 ambient temperature [c] input offset current [na] 4v 15v 7.5v figure 17. common mode rejection ratio - ambient temperature (vcc/vee=+15v/-15v, vicm=-12v to +12v) 0 25 50 75 100 125 150 -50 -25 0 25 50 75 100 125 ambient temperature [c] common mode rejection ratio [db] figure 14. input offset current - supply voltage (vicm=0v, out=0v) -60 -40 -20 0 20 40 60 0 2 4 6 8 10 12 14 16 supply voltage [v] input offset current [na] 105 -40 25 25 105 -40 -5 -4 -3 -2 -1 0 1 2 3 4 5 -4-3-2-101234 input offset voltage[mv] common mode input voltage[v] downloaded from: http:///
datasheet www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz02201-0rar1g200630-1-2 tsz22111 ? 15 ? 001 10/17 20.feb.2013 rev.001 ba4558yxxx-m ba4558yxxx-m (*) the above data is measurement value of typical sample, it is not guaranteed. figure 18. power supply rejection ratio - ambient temperature (vcc/vee=+4v/-4v to +15v/-15v) 0 25 50 75 100 125 150 -50-25 0 255075100125 ambient temperature [ ] pow er supply rejection ratio [db] . figure 19. slew rate - supply voltage (cl=100pf, rl=2k ? , ta=25 ) 0.0 0.5 1.0 1.5 2.0 2 4 6 8 10 12 14 16 supply voltage [v] slew rate [v/ s] . figure 20. equivalent input noise voltage - frequency vcc/vee=+15v/-15v, rs=100 ? , ta=25 ) 0 20 40 60 80 11 01 0 01 0 0 0 frequency [khz] intput referred noise voltage [nv/ hz] figure 21. total harmonic distortion - output voltage (vcc/vee=+15v/-15v,av=20db, rl=2k ? , 80khz-lpf, ta=25 ) 0.0001 0.001 0.01 0.1 1 0.1 1 10 output voltage [vrms] total harmonic distortion [%] 20khz 20hz 1khz downloaded from: http:///
datasheet www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz02201-0rar1g200630-1-2 tsz22111 ? 15 ? 001 11/17 20.feb.2013 rev.001 ba4558yxxx-m ba4558yxxx-m (*) the above data is measurement value of typical sample, it is not guaranteed. figure 22. maximum output voltage swing C frequency (vcc/vee=+15v/-15v, rl=2k ? , ta=25 ) 0 5 10 15 20 25 30 1.e+01 1.e+02 1.e+03 1.e+04 1.e+05 1.e+06 frequency [hz] maximum output voltage swing [v p- p ] 10 10 2 10 3 10 4 10 5 10 6 0 10 20 30 40 50 60 1.e+ 00 1.e+ 01 1.e+ 02 1.e+ 03 1.e+ 04 1.e+ 05 1.e+ 06 1.e+ 07 1.e+ 08 frequency [hz] voltage gain [db] -180 -150 -120 -90 -60 -30 0 phase [deg] gain phase 1 10 10 2 10 3 10 4 10 5 10 6 10 7 10 8 figure 23. voltage gain, phase - frequency (vcc/vee=+15v/-15v, av=40db, rl=2k ? , ta=25 ) downloaded from: http:///
datasheet www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz02201-0rar1g200630-1-2 tsz22111 ? 15 ? 001 12/17 20.feb.2013 rev.001 ba4558yxxx-m power dissipation power dissipation (total loss) indicates the power that the ic can consume at ta=25c (nor mal temperature). as the ic consumes power, it heats up, causing its temperature to be higher than the ambient temperature. the allowable temperature that the ic can accept is limited. this depends on the circuit configuration, manufacturing process, and consumable power. power dissipation is determined by the allowable temperature within the ic (maximum junction temperature) and t he thermal resistance of the package used (heat dissipation capabilit y). maximum junction temperature is typically equal to the maximum storage temperature. the heat generated through the cons umption of power by the ic radiates from the mold resin or lead frame of the package. thermal resistance, represented by the symbol jac/w, indicates this heat dissipation capability. similarly, the temperature of an ic inside its package can be estimated by thermal resistance. figure 24. (a) shows the model of the thermal resistance of the package. the equation below shows how to compute for the thermal resistance ( ja), given the ambient temperature (ta), maximum junction temperature (tjmax), and power dissipation (pd). ja = (tjmax - ta) / pd /w ????? ( ) the derating curve in figure 24. (b) indicates the power that the ic can consume with reference to ambient temperature. power consumption of the ic begins to attenuate at certain temperatures. this gradient is determined by thermal resistance ( ja), which depends on the chip size, power consumption, package, ambient temperature, package condition, wind velocity, etc. this may also vary even when the same of package is used. thermal reduction curve indicates a reference value measured at a specified condition. figur e 25. (c) shows an example of the derating curve for ba4558yxxx-m. ( 8 ) ( 9 ) (10) unit 6.2 5.0 4.8 mw/ when using the unit above ta=25 , subtract the value above per celsius degree . mounted on a fr4 glass epoxy board 70mm 70mm1.6mm(cooper foil area below 3%) (a) thermal resistance (b) derating curve figure 24. thermal resistance and derating 0 50 75 100 125 150 25 p1 p2 pd (max) lsi M [w] ' ja2 ' ja1 tj ' (m ax ) ja2 < ja1 ?? ta [ ] ja2 ja1 tj (m ax ) power dissipation of lsi ambient temperature figure 25. derating curve a mbient temperature ta chip surface temperature tj [ ] power dissipation pd[w] ja = ( tjmax - ta) / pd /w [ ] (c) ba4558yxxx-m 0 200 400 600 800 10 00 0 2 5 50 75 1 00 12 5 ambient temperature [ ] . power di ss ipa ti on [mw] . ba4558yfvm-m(10) ba4558yfv-m(9) BA4558YF-M(8) downloaded from: http:///
datasheet www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz02201-0rar1g200630-1-2 tsz22111 ? 15 ? 001 13/17 20.feb.2013 rev.001 ba4558yxxx-m application information null method condition for test circuit1 vcc, vee, ek, vicm unit: v parameter vf s1 s2 s3 vcc vee ek vicm calculation input offset voltage vf1 on on off 15 -15 0 0 1 input offset current vf2 off off off 15 -15 0 0 2 input bias current vf3 off on off 15 -15 0 0 3 vf4 on off large signal voltage gain vf5 on on on 15 -15 0 0 4 vf6 15 -15 0 0 common-mode rejection ratio (input common-mode voltage range) vf7 on on off 3 -27 0 0 5 vf8 27 -3 0 0 power supply rejection ratio vf9 on on off 4 -4 0 0 6 vf10 15 -15 0 0 - calculation - 1. input offset voltage (vio) 2. input offset current (iio) 3. input bias current (ib) 4. large signal voltage gain (av) 5. common-mode rejection ration (cmrr) 6. power supply rejection ratio (psrr) figure 26. test circuit1 (one channel only) [v] rs / rf + 1 vf1 vio ? [a] rs) / rf + (1 ri vf1 - vf2 iio ? [a] rs) / rf + (1 ri2 vf3 - vf4 ib ? [db] vf6 - vf5 rf/rs) +(1 ek log 20 av ? [db] vf7 - vf8 rf/rs) +(1 vicm log 20 cmrr ? [db] vf9 - vf10 rf/rs) +(1 vcc log 20 psrr ? vcc rf=50k ri=10k rs=50 rl sw2 500k 500k 0.1f ek 15v dut vee 50k vicm sw1 ri=10k vo vf rs=50 1000pf 0.1f -15v null sw3 downloaded from: http:///
datasheet www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz02201-0rar1g200630-1-2 tsz22111 ? 15 ? 001 14/17 20.feb.2013 rev.001 ba4558yxxx-m switch condition for test circuit 2 sw no. sw 1 sw 2 sw 3 sw 4 sw 5 sw 6 sw 7 sw 8 sw 9 sw 10 sw 11 sw 12 sw 13 sw 14 supply current off off off on off on off off off off off off off off maximum output voltage (high) off off on off off on off off on off off off on off maximum output voltage (low) off off on off off on off off on off off off on off output source current off off on off off on off off off off off off off on output sink current off off on off off on off off off off off off off on slew rate off off off on off off off on on on on off off off gain bandwidth product off on off off on on off off on on on off off off equivalent input noise voltage on off off off on on off off off off on off off off figure 27. test circuit 2 (each op-amp) figure 28. slew rate input waveform figure 29. test circuit 3(channel separation) 40db amplifier 40db amplifier vcc vee r1 v r2 r1//r2 out1 =0.5vrms vin vcc vee r1 v r2 r1//r2 out2 other ch vh vl input wave t input voltage vh vl t v output wave sr v/ t t output voltage 90% 10% c out2 out1 100 log 20 cs ? ? ? (r1=1k ? , r2=100k ? ) downloaded from: http:///
datasheet www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz02201-0rar1g200630-1-2 tsz22111 ? 15 ? 001 15/17 20.feb.2013 rev.001 ba4558yxxx-m operational notes 1) processing of unused circuit it is recommended to apply connection (see the figure 30.) and set the non inverting input terminal at the potential within input common-mode voltage range (vicm), for any unused circuit. 2) input voltage applying (vee - 0.3) to (vee + 36)v (ba4558r) to the input terminal is possible without causing deterioration of the electrical characteristics or destruction, irrespective of the supply voltage. however, this does not ensure normal circuit operation. please note that the circuit operates normally only when the input voltage is within the common mode input voltage range of the electric characteristics. 3) maximum output voltage because the output voltage range becomes narrow as the output current increases, design the application with margin by considering changes in electrical characteristics and temperature characteristics. 4) short-circuit of output terminal when output terminal and vcc or vee term inal are shorted, excessive output current may flow under some conditions, and heating may destroy ic. it is necessary to connect a resistor as shown in figure 31., thereby protecting against load shorting. 5) power supply (split supply / single supply) in used op-amp operates when specified voltage is applied between vcc and vee. therefore, the single supply op-amp can be used for double supply op-amp as well. 6) power dissipation (pd) use a thermal design that allows for a sufficient margin in light of the power dissipation (pd) in actual operating conditions. 7) short-circuit between pins and wrong mounting pay attention to the assembly direction of the ics. wrong mount ing direction or shorts between terminals, gnd, or other components on the circuits, can damage the ic. 8) use in strong electromagnetic field using the ics in strong electromagnetic field can cause operation malfunction. 9) radiation this ic is not designed to be radiation-resistant. 10) ic handling when stress is applied to ic because of deflection or bend of board, the characteristics may f luctuate due to piezo resistance effects. 11) inspection on set board during testing, turn on or off the power before mounting or dismounting the board from the test jig. do not power up the board without waiting for the output capacitors to discharge. the capacitors in the low output impedance terminal can stress the device. pay attention to the electro static voltages during ic handling, transportation, and storage. 12) output capacitor when vcc terminal is shorted to vee (gnd) potential and an electric charge has accumulated on the external capacitor, connected to output terminal, accumulated charge may be discharged vcc terminal via the parasitic element within the circuit or terminal protection element. the element in the circuit may be damaged (thermal destruction). when using this ic for an application circuit where there is oscillation, output capacitor load does not occur, as w hen using this ic as a voltage comparator. set the capacitor connected to output terminal below 0.1 f in order to prevent damage to ic. application circuit for unused op-amp figure 30. the example of figure 31. the example of output short protection connect to vicm vcc vee vicm - + vee vcc + - protection resistor downloaded from: http:///
datasheet www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz02201-0rar1g200630-1-2 tsz22111 ? 15 ? 001 16/17 20.feb.2013 rev.001 ba4558yxxx-m physical dimensions tape and reel information ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin (unit : mm) sop8 0.9 0.15 0.3min 4 + 6 4 0.17 +0.1 - 0.05 0.595 6 43 8 2 5 1 7 5.0 0.2 6.2 0.3 4.4 0.2 (max 5.35 include burr) 1.27 0.11 0.42 0.1 1.5 0.1 s 0.1 s ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin (unit : mm) ssop-b8 0.08 m 1234 5678 0.1 0.22 0.10 0.3min 0.65 (0.52) 3.0 0.2 0.15 0.1 6.4 0.3 1.15 0.1 4.4 0.2 (max 3.35 include burr) s 0.1 direction of feed reel ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper right when you hold reel on the left hand and you pull out the tape on the right hand 3000pcs tr () 1pin (unit : mm) msop8 0.08 s s 4.0 0.2 8 3 2.8 0.1 1 6 2.9 0.1 0.475 4 57 (max 3.25 include burr) 2 1pin mark 0.9max 0.75 0.05 0.65 0.08 0.05 0.22 +0.05 0.04 0.6 0.2 0.29 0.15 0.145 +0.05 0.03 4 + 6 4 downloaded from: http:///
datasheet www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz02201-0rar1g200630-1-2 tsz22111 ? 15 ? 001 17/17 20.feb.2013 rev.001 ba4558yxxx-m marking diagram land pattern data all dimensions in mm pkg land pitch e land space mie land length ? 2 land width b2 sop8 1.27 4.60 1.10 0.76 ssop-b8 0.65 4.60 1.20 0.35 msop8 0.65 2.62 0.99 0.35 revision history date revision changes 20.feb.2013 001 new release product name package type marking ba4558y f-m sop8 58ym fv-m ssop-b8 58ym fvm-m msop8 58ym sop8(top view) part number marking lot number 1pin mark ssop-b8(top view) part number marking lot number 1pin mark msop8(top view) part number marking lot number 1pin mark b e e ? sop8, ssop-b8, msop8 downloaded from: http:///
datasheet d a t a s h e e t notice - ss rev.002 ? 2014 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extremely high reliability (such as medical equipment (note 1) , aircraft/spacecraft, nuclear power controllers, etc.) and whos e malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sales representative in advance. unless otherwise agreed in writ ing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses in curred by you or third parties arising from the use of any rohms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are not designed under any special or extr aordinary environments or conditi ons, as exemplified below. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohms products under an y special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet d a t a s h e e t notice - ss rev.002 ? 2014 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice C we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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